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PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
11-Sep-2013
Orderable Device
Status
Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
(1)
Drawing
Qty
(2)
(3)
(4/5)
TMS320C5515AZCH10
ACTIVE
NFBGA
ZCH
196
168
Green (RoHS
SNAGCU
Level-3-260C-168 HR
-10 to 70
15AZCH10
& no Sb/Br)
TMS320C5515AZCH12
ACTIVE
NFBGA
ZCH
196
168
Green (RoHS
SNAGCU
Level-3-260C-168 HR
-10 to 70
15AZCH12
& no Sb/Br)
TMS320C5515AZCHA10
ACTIVE
NFBGA
ZCH
196
168
Green (RoHS
SNAGCU
Level-3-260C-168 HR
-40 to 85
15AZCHA10
& no Sb/Br)
TMS320C5515AZCHA12
ACTIVE
NFBGA
ZCH
196
168
Green (RoHS
SNAGCU
Level-3-260C-168 HR
-40 to 85
15AZCHA12
& no Sb/Br)
TMX320C5515AZCH12
OBSOLETE
NFBGA
ZCH
196
TBD
Call TI
Call TI
-10 to 70
TMX320
VC5515A12
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
(4)
(5)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
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